Amtech SynTECH-LF TF Very low global warning potential so cleaning is not required

so cleaning is not required to meet IPC standards

Keep the solder paste container sealed while warming the solder paste to operating temperature

Alloy Temp °C Temp °F 63Sn/37Pb 183 361 Test Results

Surface Insulation Resistance 85 oC

62Sn/36Pb/2Ag

Amtech SynTECH-LF TF Very low global warning potential so cleaning is not requiredTechnical Data Sheet Safety Data Sheet Amtech SynTech LF TF is formulated for syringe, stencil printing, and rework applications on all PCB surface finishes. Amtech SynTECH LF TF may be used for BGA sphere attachment and reballing. It is also designed to work on all flip chip bumping and chip scale packaging sites. Product Highlights ROL0 flux classification Wide process window Excellent wetting compatibility on most board finishes Clear residue Low