LFE2-20E-6FN484C and advanced research applications where

and advanced research applications where programmable logic and high performance are essential

Compact 153-MBGA Package: Space-efficient 8x8mm ball grid array for high-density PCB designs

Surface Mount Technology - Easy integration into automated assembly processes

AGL600V2-FG256 - High-Performance IGLOO FPGA from Microchip Technology

Advanced Packaging: 2397-FBGA flip-chip ball grid array ensures optimal signal integrity

LFE2-20E-6FN484C and advanced research applications whereProduct attributes Property Value Manufacturer Lattice Semiconductor Corporation Product Series ECP2 Packaging Tray Tray Number of LABs CLBs 2625 Number of Logic Elements Cells 21000 Total RAM Bits 282624 Number of I O 331 Number of Gates Voltage Supply 1. 14V ~ 1. 26V Mounting Type Surface Mount Operating Temperature 0C ~ 85C (TJ) Grade Qualification Package Case 484 BBGA Supplier Device Package 484 FPBGA (23x23) ROHS