3\" Diamond Copper Bond Polishing Pads with Hook and Loop Backing OEM Customizable for Concrete and Terrazzo Floor Grit:800# Connection: HTC EZ Change Connection

Connection: HTC  EZ Change Connection

Blastrac Trapezoid Split PCD Diamond Grinding Shoes for epoxy

please contact us with your HTC machine model for verification

Stable & Vibration-Free Grinding – Precision-engineered for even pressure distribution

Machine:  HTC  Quick Connceting Grinding Machine

3\" Diamond Copper Bond Polishing Pads with Hook and Loop Backing OEM Customizable for Concrete and Terrazzo Floor Grit:800# Connection: HTC EZ Change ConnectionProduct Description Copper bond diamond floor polishing grinding pads provide longer life and achieve better results with less or no scratching marks while polishing concrete floor. They are aggressive cut and have a beveled edge that easily glides over lippage. These pads feature a bi metal bond with a high concentration of diamonds for faster alternative than normal resins. They are ideal for removing deep scratches left behind from metal and vacuum