DiaSec Diamond Wafering Blade - General Purpose Metallography 4in Silicon Carbide The high viscosity formulation delivers

The high viscosity formulation delivers excellent diamond retention on polishing cloths for improved abrasive utilization

designed for fast material removal and excellent flatness during coarse polishing steps

Item No RM-21255

Get 10/pkg and achieve precise specimen mounting

Composites

DiaSec Diamond Wafering Blade - General Purpose Metallography 4in Silicon Carbide The high viscosity formulation deliversThe DiaSec General Purpose Diamond Blade is a must have for metallurgical sample preparation. Made with metal bonding, this 4in x 0. 016in blade can effortlessly cut through steel, stainless steel, copper, aluminum, Ni alloys, and titanium. Its versatility and precision make it an essential tool for any industry expert. Diameter: 4in (100mm) Thickness: 0. 016in (0. 4mm) Arbor: 0. 5in (12. 7mm) Item No DS 1004 1 pkg